多彩な実績と豊富な知識で期待値を超えて信頼できる基板設計は!?
回路設計図から意図を紐解き、見栄えにもこだわる基板設計は!?
検討段階から特性効果・正常動作までをイメージした基板設計は!?
ココにあるんじゃない？！
BOARD DESIGN
Power supply board
Pattern design is just as important as circuit design in power supply design.
Improper layout leads to increased noise, poor regulation and lack of stability. However, to put it the other way around, it means that noise can be suppressed by arranging and wiring with careful consideration of them. We have abundant designers who also design power supply boards.
High frequency board
High-frequency boards, where control of signal transmission speed and loss is of utmost importance, are required to form highly accurate signal wiring.
The material of the board to be used is selected in consideration of the loss due to the frequency used and the ease of handling of the board.
We also propose composite multilayer printed wiring boards (hybrid boards) from the viewpoint of unit miniaturization and cost reduction.
Double-sided to high-multilayer board
We have many achievements from double-sided boards to high-density and high-multilayer boards.
Our motto is to understand the characteristics of parts and to design with consideration for board manufacturing and mounting after design. We often hear from customers who request us that the response and response during design is good.
High speed digital
Check the waveform by simulation depending on the conditions
We perform uniform delay wiring.
Case 1
Main mounted parts
KINTEX UltraSCALE
DDR3 SO-DIMM x 2
Operating frequency: 933MHz
Check the waveform by pre-simulation
Equal delay (5ps) wiring
Case 2
Relay board
FMC-QSFP
LVDS 100Ω 10Gbps
Wiring layer L3, L6
6-layer penetration configuration
(MEG TRON 6 is used as the base material)
Interface
We have a track record of designing for various interfaces.
Firefly
(LVDS 100Ω 14Gbps)
QSFP + 100Ω 10Gbps
USB3.0
In addition, DVI, FMC, XFP, HDMI, etc.
Narrow pitch BGA / CSP
We have a track record of designing and implementing narrow pitch CSP projects with a pitch of 0.3 mm to 0.5 mm.
Case 1
Bump pitch 0.5mm
Bump diameter 270 μm
Bump height 190 μm
Case 2
Bump pitch 0.3mm
Bump diameter 130 μm
Bump height 100 μm
Wire bonding
Not only the design based on the pad size specified by the user, but also the chip information is available.
We proceed with pattern design in consultation with the manufacturing process and mounting process, and board creation and mounting.
We will deliver it in the completed state.
Case 1
Bonding point
Chip-132 pads on board
First pad pitch 100 μm
Second pad width 150 μm / pitch 300 μm
Case 2
Bonding point
Chip-110 pads on the board
Chip-Chip 32 locations
First pad pitch 100 μm
Second pad width 100 μm / pitch 200 μm
Power supply board
Thick copper substrates can also be used for high-current and high-voltage circuits.
Flexible board
We also have a track record of impedance control for flexible boards.
LVDS D 100Ω
800Mbps
We try to design with EMI in mind.
It is also possible to perform electromagnetic field simulation analysis and surface resonance analysis during the artwork or before manufacturing.
We also support pre-simulation such as SI.
Example of pre-simulation [DDR3]
Wiring work can be started after pre-simulating SI, and various analyzes can be performed from CAD data.
主な設計CADツール
・CR-5000/Board Designer CADVANE αⅢ Altium Designer その他
ラグレス基板設計における４箇条
1 ラグレスの基板設計は、顧客様のご希望・ご要望を第一優先として進行してまいります。
2 ラグレスの基板設計は、顧客様と担当設計者(担当営業含む)の二人三脚で進行してまいります。
3 イレギュラーな事柄は、担当営業および、担当設計者が誠意を持って、迅速に最後まで解決に尽力してまいります。
4 各重要フェーズ(仕様検討・配置・配線のFIX時)等では、TEL・メールでのデータのやり取りだけでなく、
対面または、WEB打合せによる擦り合わせ・認識合わせを実施して、効率と品質の向上に最大限に努めてまいります。